Feature

●Adjustable platform easily makes all Size components thinner than a big die
●Multipurpose platform along with cutting pads are required to create a sandwich for accommodating Framelits and Thinlits as well as competitors’ wafer-thin dies
●Designed for use in the big shot and big kick machines as well as in the big shot express and vagabond machines


Description

If its thinner than a Big Die, this revolutionary platform for all Size components easily makes it compatible with the BIG kick and Big Shot machines. It even works with other brands dies and embossing tools.