Feature

●Product name: Yellow 3240 epoxy resin board insulation board;
●Overall length: 500MM×250MM; Thickness: 0.1mm-20mm;
●Applicable to: high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties as well as good heat resistance and moisture resistance.
●Features: The cured epoxy resin system has excellent mechanical properties, high mechanical strength at medium temperature, and good electrical stability at high humidity.
●Electrical properties: The cured epoxy resin system is an excellent insulating material with high dielectric properties, surface leakage resistance and arc resistance.

[4MM-thick 500MM-250MM-2pcs]





Description

3240 full name epoxy laminated glass cloth board
Regular thickness: 0.1mm--50mm, please contact me if you need other thickness or other dimensions (in addition, you can set the thickness of 50MM-150MM)

Product name: 3240 epoxy resin board insulation board
Color: Yellow
Thickness: 0.1mm-20mm.
Features: high mechanical properties at medium temperature, stable electrical properties at high temperature;
Applicable to: high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties as well as good heat resistance and moisture resistance.

The 3240 epoxy laminate has a smooth surface, no air bubbles, no pits and wrinkles, but allows for other defects that do not affect the use, such as: scratches, indentations, stains and small spots. The edges should be cut neatly and the end faces must be free of delamination and cracks.
Temperature rating: Class B
Color: natural (yellow)
Characteristics: The cured epoxy resin system has excellent mechanical properties, high strength at medium temperature, and good electrical stability under high humidity.
Electrical: The cured epoxy resin system is an excellent insulating material with high dielectric properties, surface leakage resistance and arc resistance.
Uses: Suitable for mechanical, electrical, electronic, electrical and other fields. Also used for the processing of insulating parts, processing into various types of insulating parts and equipment insulation structural parts.

The reaction of the epoxy resin and the curing agent used is carried out by a direct addition reaction or a ring-opening polymerization reaction of an epoxy group in a resin molecule, without the release of water or other volatile by-products. They exhibit very low shrinkage (less than 2%) during curing compared to unsaturated polyester resins and phenolic resins.