Features: 1.6 in 1 design, which can implant a plurality of chips.
2.These stencils were made of high quality stainless steel plate, the thickness of steel mesh is appropriate.
3.It adopted the special plump design which can avoid Heat dissipation.
4.It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering.
5.It is specially designed for BGA153/ 162/ 169/ 186/ 221/ 254/ EMMC.
Specifications:
Material: High Quality Stainless Steel
Weight: Approx. 6g
Compatible with: BGA221, BGA153, BGA169, BGA254, BGA162, BGA186
Package Included:
1 x BGA stencils
Notice:
1.Please allow 13 cm error due to manual measurement. Thanks for your understanding.
2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.