Feature
●High Thermal Conductivity - With a thermal conductivity rate of 0.975W/m-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding. It is suitable for all heatsinks without a fixed clip, and can be used for a wide range of applications.
●Safe and Non-Electrical Conductive - This thermal adhesive is non-electrical conductive, safe, and non-toxic, making it safe for both users and electronic components. It is odorless, moisture-resistant, and non-swelling, ensuring that it does not damage the substrate over time. Important: it is important to note that this thermal glue should not be used between the CPU and heatsink.
●Strong Adhesion - This thermal plaster features strong adhesion properties that allow it to bond with most metals and non-metals, ensuring a reliable and long-lasting connection. The adhesion and tensile strength is 2.1（MPA）, making it a high-performance option that delivers excellent results.
●Quick Drying Time - This thermal adhesive cures quickly upon contact with air, with a drying time of approximately 30 minutes at 25℃. This makes it easy and convenient to apply, with minimal downtime required.
●Wide Service Temperature Range - With a service temperature range of -60~250 degrees Celsius, this thermal adhesive is suitable for use in a wide range of industries and applications. It has good thermal conductivity and stability, and is ideal for use in electrical appliances, instruments, and other industries that require effective heat dissipation.
Description
Feature
- It has thermally conductive properties and is highly adhesive.
- Simple to use. Suitable for all heatsink without fixed clip.
- Can be applied for MOSFET, LED, heat sinks , graphics card , Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
Package Included
- 2pcs x Thermal Paste(1pcs - 10g)
- 2pcs x Clean Cloth
Note
- Due to the light and screen difference, the items color may be slightly different from the pictures.
- Please allow 1-3mm differences due to manual measurement.
- Do not use thermal glue between CPU and HEATSINK.
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Safety Application
Eliminates the risk of accidental electrical connections between components
Being non-volatile and flame retardant means that the glue wont emit harmful gases or fumes when exposed to high temperatures. |
Stable and Long-Lasting
The adhesion and tensile strength is 2.1（MPA）
Stable maintenance of high performance over a long period of time |
Wide Service Temperature Range
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Usage Scenarios
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| 25g HY450 | 2 Pack 10g HY910 | 20g HY710 | 10 Pack HY880 | |
| Weight/Size | 25g | 20g | 20g | 10g-（1g/pcs） |
| THermal conductivity | 2.15 W/MK | 0.975W/m-k | 3.17 W/MK | 5.15 W/MK |
| Coloer | white | white | gray | gray |
| Operating Temperature | -30°C~280° | -60°C~250° | -30°C~230° | -30°C~280° |
| Usage Scenarios | CPU/ Processor/ Computer | MOSFET/LED/heat sinks | CPU/ Processor/ Computer | CPU/ Processor/ Computer |
| Spatula Included | ✓ | X | ✓ | ✓ |
