Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Viscosity @ 25 C cps: Soft Paste Shelf Life: 6 months Typical Application: microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and Electronic component manufacturing. Benefits: passes NASAs outgassingcures quickly at elevated temperaturesdesigned for ease in handlingoffers excellent mechanical, electrical and physical properties Hardness, Shore D: 88 Volume Resistivity ohm-cm: 3.8 x 10-2 2 Hours: @ 125 C 1 hour: @ 150C 30 min: @ 175 C Thermal Conductivity, Btu/hr/ft2/F/in:: 10.1 Operating Temp. Range, C: -55 to +175 TML (Total Mass Loss): % 0.25 CVCM (Collected Volatile Condensable Materials): % 0.00 WVR (Water Vapor Recovery): % 0.07 Nickel-Bond N2 Electrically Conductive Nickel Epoxy Adhesive, 1 Part, Heat Cure is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid Processing and assembly.Nickel-Bond N2 Electrically Conductive Nickel Epoxy Adhesive, 1 Part, Heat Cure passes NASAs outgassing testing (ASTM E-595) and is listed in NASAs Outgassing Data for Selecting Spacecraft Materials list.Nickel-Bond N2 Electrically Conductive Nickel Epoxy Adhesive, 1 Part, Heat Cure offers excellent mechanical, electrical, and physical properties at continuous operating Temperatures up To 175C. This versatile nickel conductive adhesive can be used for chip bonding in Micro and electronic hybrid circuit Fabrication. This unique conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures up to 325C.Nickel-Bond N2 Electrically Conductive Nickel Epoxy Adhesive, 1 Part, Heat Cure has also been used in microwave application