MAX MCR Product Description

MAX MCR BLACK A/B is a medium working time, low viscosity potting compound resin system for embedding and encapsulating printed circuit boards (PCB), relays, coils, and other electronic components and circuitry. MAX MCR is formulated for extreme weather conditions, from freezing cold to desert heat temperatures.

MAX MCR A/B is mixed 2:1 by weight or by volume and provides a 30-minute working time (200-gram mass). The mixed consistency is similar to that of olive oil, and it is poured in place, injected, or adaptable for mix meter dispensing equipment. MAX MCR A/B is non-electrically conductive upon cure. It creates a permanent barrier that prevents direct physical contact with the circuitry. It cures to a hard and tough compound that is suitable for potting small to medium parts up to 6 ounces (180 grams) in mass without excessive exothermic heat generation.

MAX MCR A/B bonds to PVC, PP, ABS, Plastisol, aluminum, steel, copper, brass, and other materials typically used in electrical assembly and printed circuit boards. Upon cure, MAX MCR A/B is hard and waterproof suitable for continuous water immersion and exposure to harsh environments that protect electrical connections from corrosion. Its opaque black color permanently masks proprietary circuit design and identification of the electronic components.

PHYSICAL PROPERTIES & MECHANICAL PROPERTIES Mix Ratio: 2:1 by Weight Or Volume Mixed Viscosity: 1,950 cPs @75°F Density: 1.10 G/CC Working Time: 30 Minutes Cure Time: 24 Hours @75°F Accelerated Cure: 2 Hours @ 200°F Hardness: 78 Shore D Volume Resistivity: 4.7 X 10 Exponent 13 Ohms-Cm Dielectric Strength: 510 Volts/Mil @ 60 Cycles Dielectric Constant: 4.0 (10 kHz) Thermal Conductivity: 0.25 W/°F/mK