Mix Ratio by weight: 100:5 / Resin:Hardener Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Minimum Bond Line Thickness: 1mm Glass Transition Temp, Tg: 50 C Typical Applications: Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair Viscosity @ 25 C cps: Paste Specific Gravity, mixed: 2.79 Reactive solids contents, %: 100 Pot Life: 1 Hour Shelf Life: 1 Year Hardness, Shore D: 85 Shrinkage linear in/in: 0.003 Tensile Strength, psi: 9500 Volume Resistivity ohm. cm: <0.038 Compressive Strength, psi: 14,000 15 minutes: @ 100C 45 minutes: @ 50C 24 hours: Room temperature Thermal Conductivity, btu/hr/ft2/F/in: 9.4 Thermal Expansion Coefficient, (cm / cm / C 10-5): 1.5 Heat Distortions, C: 95 Operating Temperature Range, C: -50 to +170 Nickel-Bond 3 Electrically Conductive, Nickel Filled Epoxy Adhesives, Room Temp Cure is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 3.8x10-2 ohm-cm.Nickel-Bond 3 Electrically Conductive, Nickel Filled Epoxy Adhesives, Room Temp Cure is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.Nickel-Bond 3 Electrically Conductive, Nickel Filled Epoxy Adhesives, Room Temp Cure has been used extensively in such diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply Nickel-B