Feature

●Simple design to perfectly protect the cooling module
●High thermal conductive adhesive
●Supports Intel & AMD motherboards
●Selected high-quality IC, Supports XMP2.0
●Lifetime warranty


Description

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Enhanced Heat Dissipation

Built with reenforced aluminum heat spreader and thermal conductive adhesive - a combination of simplicity in design and efficiency for cooling.

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Stable and Durable

Every IC chip is selected through a rigorous testing process, ensuring the best performance and stability for overclocking and gaming.

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Wide compatibility

Fully optimized to be compatible with the latest DDR4 Intel and AMD platforms.

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Overclocking in a breeze

Supports XMP 2.0. Customize your own profile and release the potential of your memory with a single click.

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High performance, low power consumption

In addition to the increase in data transfer rate, the basic working voltage of the new generation of DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.


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